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SIGCD: Digital and Analogue Circuit Design
There were originally two SIGs covering Digital and Analogue Circuits. They were merged with the focus on supporting software for:
- Interactive small circuit analysis and design
- Large system analysis
- Microwave engineering (transmission lines, microstrips, etc)
- Interactive pre- and post-processing
- System modelling and simulation (analogue and digital)
- Establishment of a library of device and material characteristics
- Digital system specification
- Synthesis
- Simulation and fault analysis
- Testing and test generation
- Transient analysis of digital structures
- IC design and layout
- PCB design and layout
- Guidance and implementation aids for microprocessors
- Database system
The SIG mounted the following programs:
| Software | Description | Machine |
|---|---|---|
| ICAP | AC Analysis | PRIME |
| ITAP | Transient Analysis | PRIME |
| SP | Scattering Parameter Analysis | PRIME |
| NAP | AC, DC, Transient Analysis | IBM, PRIME (also user courses) |
| SPICE | AC, DC, Transient Analysis | IBM |
| ASTAP | More flexible analysis program | IBM |
| SCEPTRE | Considers effect of radiation | IBM |
| CSMP | General simulation and analysis | IBM |
| ANP | Frequency and time-domain analysis | IBM, Prime |
| DDL | Digital Design Language | DEC 10 |
| DIGSIM | Statistical Logic Simulator | DEC 10 |
| ISPS | Simulator for ISP language | DEC 10 |
| PCIRC | PCB Layout | PRIME |
| HELP | Comprehensive information and help system | DEC 10 |
| GAELIC | IC Layout | DEC 10 and Prime |
Some of the projects that used the software were:
| University/Institute | Project |
|---|---|
| Bath | Nonlinear magneto-static problems |
| Bristol | Load variation analysis on communications network |
| RAL (SNS Project) | Transient and frequency analysis of large power supplies. |
| Southampton | Circular transistor modelling. MOSFET multiplier configuration modelling. |
| Birmingham | Various analogue electronic design problems |
| London | Data flow architecture investigation |
The SIG was eventually merged with a parallel activity promoted by the Solid State Devices Subcommittee of SERC on design, placement and layout for digital ICs. Later still, all of the programmes in IC design became the responsibility of the Microfabrication Facilities Sub-committee of the Information Engineering Committee (IEC).